MT62F512M64D4BG-031 WT

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Orderable parts

MT62F512M64D4BG-031 WT:B

Specs

  • Chipset Validation
    N/A
  • Cycle Time
    6400 MB/s
  • Data Rate
    6400Mbps
  • Density
    32Gb
  • FBGA Code
    D9ZVX
  • Op. Temp.
    -25C to +85C
  • Part Status
    Sampling
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR5
  • Width
    x64

Simulation Models

HSPICE: 8Gb Mobile LPDDR5 Y31M

WT, AT, IT, UT, Y31M Mobile LPDDR5 SDRAM, Die Rev. B, 496b 8DP(8GB), 496b QDP(4GB), 441b 8DP(8GB), 441b QDP(4GB), 436b 8DP(8GB), 315b 8DP(8GB), 315b QDP(4GB), 315b DDP(2GB)
  • File Type: ZIP
  • Updated: 2021-03-17
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IBIS: 8Gb Mobile LPDDR5 Y31M

WT, AT, IT, UT, Y31M Mobile LPDDR5 SDRAM, Die Rev. B, 496b 8DP(8GB), 496b QDP(4GB), 441b 8DP(8GB), 441b QDP(4GB), 436b 8DP(8GB), 315b 8DP(8GB), 315b QDP(4GB), 315b DDP(2GB)
  • File Type: ZIP
  • Updated: 2021-03-17
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S-parameter: Mobile LPDDR5 Y31M 496b QDP 4GB

496b 4GB LPDDR5 SDRAM (8Gb Mobile LPDDR5 Y31M 4pcs)
  • File Type: ZIP
  • Updated: 2020-06-11
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Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25
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TN-46-22: T69M (50nm) to T79M (4xnm) Transition Guide

Transition guide for migration from T69M to T79M
  • File Type: PDF
  • Updated: 2016-06-24
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13
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CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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